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      Species

      Your location:Home > Products > Species
                                                                              Capability
      Layer1-36LMin.   finished thickness(2L)0.3mm
      Max. panel size1500mm*610mm
      Min.   finished thickness(multilayer)0.4mm
      Max. Cu thickness12OZMax.   finished thickness4.0mm
      Min.Cu thickness(base)1/3OZMin.   core thickness0.1mm
      Max.Cu thickness(base)5OZDrilling   hole to hole tolerance±0.05mm
      Aspect ratio10:1Min.   hole diameter tolerance (PTH)±0.075mm
      Etching tolerance±10%Min.   hole diameter tolerance (NPTH)±0.05mm
      Min.line with0.075mm(3mil)Min.   routing tolerance±0.10mm
      Min.line space0.075mm(3mil)Min.   stamping edge to edge tolerance±0.075mm
      Min. hole diameter0.20mmV-cut   edge to edge tolerance±0.10mm(4mil)
      Board bow and twist≤   0.75%Registration(O/L)±0.05mm(2mil)
      Impedance tolerance±10%Paterning   positioning tolerance±0.075mm(3mil)
      Hole copper thickness30umMax.test   points/Board(universal ET)Jig Test Fixture:15000
          Flying Probing:1-∞
      Surface finishHAL-LF,HASL,Immersion Gold,Immersion Silever,OSP
      Base materialFR-4,   Hi-TG FR-4, Halogern free FR-4、CEM1、CEM3, Aluminum based boards
      Standard lead timeMultilayer:9   wds,2L:7wds,sample:3-6wds



      Product information
      Product name Product picture Product parameters
      PTFE laminate - Multilayer
      Traditional antenna PCB
      應用領域:LED照明

      板材:鋁基

      層數:1L

      板厚:0.8mm

      完成銅厚1OZ

      表面處理:OSP

      應用領域:LED照明

      板材:鋁基

      層數:1L

      板厚:1.2mm

      完成銅厚1OZ

      表面處理:OSP

      應用領域:LED照明

      板材:鋁基

      層數:1L

      板厚:1.5mm

      完成銅厚1OZ

      表面處理:OSP

      Application field: automotive power supply

      材質: FR4

      層數: 8L

      板厚: 2.0mm

      銅厚: 4Oz

      最小孔徑: 0.9mm

      表面處理: 無鉛噴錫

      特性: 厚銅



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